Fast Turnkey PCB Assembly Schematic Diagram Precision Min 0201
Chips PCBA
Production Capability
SHINELINK has invested in the best equipment, environment and staff
training. We have a production capability for standard and HDI
,Rigid, RF and high frequency PCBs, together with through hole and
min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small
batch, mid volume and high volume quantities.
SHINELINK, your single point of contact for all of your raw
materials, parts, pcb assembly and finished product assembly, also
offers
1. Contract Manufacturing
2. Engineering Services
3. PCB Design & Assembly
4. Product Design
5. Prototyping
6. Cable and Wire Assemblies
7. Plastics and Molds
Shinelink kinds PCBA Products
Feature
| Number of Layer | 1 - 20 Layer |
| Maximum Processing Area | 680 × 1000MM |
| Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) |
| 4 Layer - 0.4MM ( 16 mil ) |
| 6 Layer - 0.8MM ( 32 mil ) |
| 8 Layer - 1.0MM ( 40 mil) |
| 10 Layer - 1.1MM ( 44 mil ) |
| 12 Layer - 1.3MM ( 52 mil ) |
| 14 Layer - 1.5MM ( 59 mil ) |
| 16 Layer - 1.6MM ( 63 mil ) |
| 18 Layer - 1.8MM ( 71 mil ) |
| Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
| 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
| Twisting and Bending | ≤ 0.75%, Min: 0.5% |
| Range of TG | 130 - 215 ℃ |
| Impedance Tolerance | ± 10%, Min: ± 5% |
| Hi-Pot Test | Max: 4000V/10MA/60S |
| Surface Treatment | HASL, With Lead, HASL Free Lead |
| Flash Gold, Immersion Gold |
| Immersion Silver, Immersion Tin |
| Gold Finger, OSP |
PCB Assembly Capabilities
| Turnkey PCBA | PCB+components sourcing+assembly+package |
| Assembly details | SMT and Thru-hole, ISO lines |
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days |
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test |
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK |
| Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) |
| Components: Bill of Materials(BOM list) |
| Assembly: Pick-N-Place file |
| PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) |
| Max size: 20*20 inches(500*500mm) |
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
| Components details | Passive Down to 0201 size |
| BGA and VFBGA |
| Leadless Chip Carriers/CSP |
| Double-sided SMT Assembly |
| Fine Pitch to 0.8mils |
| BGA Repair and Reball |
| Part Removal and Replacement |
| Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly
process | Drilling-----Exposure-----Plating-----Etaching &
Stripping-----Punching-----Electrical Testing-----SMT-----Wave
Soldering-----Assembling-----ICT-----Function
Testing-----Temperature & Humidity Testing |
Advantage
1. ISO& UL certified third-party testing and high-quality technical
service team.
2. Available and immediate delivery.
3. Producing capacity: 20,000sq meter/month.
4. Competitive price with no MOQ.
FAQ:
1. How do Shinelink keep your price competitive?
Over the last decade, prices of many raw materials (e.g. copper,
chemicals) had doubled, tripled or quadrupled; Chinese currency RMB
had appreciated 31% over US dollar; And our labor cost also
increased significantly.
However, Shinelink have kept our pricing steady. This owns entirely to our
innovations in reducing cost, avoiding wastes and improving
efficiency. Our prices are very competitive in the industry at the
same quality level.
We believe in a win-win partnership with our customers. Our
partnership will be mutually beneficial if we can provide you an
edgeon cost and quality.
2. What kinds of boards can Shinelink process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon,
aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB & PCBA production?
BOM (Bill of Materials) with reference designators: component
description, manufacturer’s name and part number.
PCB Gerber files.
PCB fabrication drawing and PCBA assembly drawing.
Test procedures.
Any mechanical restrictions such as assembly height requirements.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI →
Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel
Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer
AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T
→ Visual Inspection.
