Item | Mass production | Small batch production |
Number of layers | UP TO 18L | UP TO L |
Laminate type | FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum
based, PTEE, Rogers or more. | FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum
based, PTEE, Rogers or more. |
Maximum board size | 610mm*1100mm | 610mm*1100mm |
Board thickness | 0.1mm-7.00mm | ＜0.1mm and ＞7.00mm |
Minimum line width/space | 3.5mil(0.0875mm) | 3mil(0.075mm) |
Minimum line gap | +/-15% | +/-10% |
Outer layer copper thickness | 35um-175um | 35um-210um |
Inner layer copper thickness | 12um-175um | 12um-210um |
Drilling hole size(Mechanical) | 0.15mm-6.5mm | 0.15mm-6.5mm |
Finished hole size (Mechanical) | 0.15mm-6.0mm | 0.15mm-6.0mm |
Board thickness hole size ratio | 14:1 | 16:1 |
Board thickness tolerance(t=0.8mm) | ±8% | ±5% |
Board thickness tolerance(t＜0.8mm) | ±10% | ±8% |
Min. grid line width | 4mil(12, 18, 35um), 6mil(70um) | 4mil(12, 18, 35um), 6mil(70um) |
Min. grid spacing | 6mil(12, 18, 35um), 8mil(70um) | 6mil(12, 18, 35um), 8mil(70um) |
Hole size tolerance(Mechanical) | 0.05-0.075mm | 0.05mm |
Hole position tolerance(Mechanical) | 0.005mm | 0.005mm |
Solder mask color | Green, Blue, Black, White, Yellow, Red, Grey etc. | Green, Blue, Black, White, Yellow, Red, Grey etc. |
Impedance control tolerance | +/-10% | +/-8% |
Min. distance between drilling to conductor(non-blind buried
orifice) | 8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L) | 6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L) |
Min. Character width and height(35um base copper) | Line width: 5mil
Height: 27mil | Line width: 5mil; height: 27mil |
Max. test voltage | 500V | 500V |
Max. test current | 200mA | 200mA |
Surface treatment
| Flash Gold | 0.025-0.075um | 0.025-0.5um |
Immersion Gold | 0.05-0.1um | 0.1-0.2um |
Sn/Pb HASL | 1-70um | 1-70um |
Lead-free HASL | 1-70um | 1-70um |
Immersion Silver | 0.08-0.3um | 0.08-0.3um |
OSP | 0.2-0.4um | 0.2-0.4um |
Gold Finger | 0.375um | >=1.75um |
Hard Gold Plating | 0.375um | >=1.75um |
Immersion Sin | 0.8um |
|
V-Cut rest thickness tolerance | ±0.1mm | ±0.1mm |
Outline profile
| Chamfer | The angle type of the chamfer | 30,45,60 |
Plug via hole | Max.size can be plugged | 0.6mm |
Largest NPTH hole size | 6.5mm | >6.5mm |
Largest PTH hole size | 6.5mm | >6.5mm |
Min. solder spacer ring | 0.05mm | 0.05mm |
Min. solder bridge width | 0.1mm | 0.1mm |
Drilling diameter | 0.15mm-0.6mm | 0.15mm-0.6mm |
Min. pad diameter with hole | 14mil( 0.15mm drilling) | 12mil( 0.1mm laser) |
Min. BGA pad diameter | 10mil | 8mil |
Chemical ENIG gold thickness | 0.025-0.1um(1-4U) | 0.025-0.1um |
Chemical ENIG nickel thickness | 3-5um(120-200U) | 3-5um |
Min. resistance test | Ω | 5 |
