Multi-layer pcba board 8 layers pcb board assembly with ENIG
Shinelink Company Advantage
1. ISO& UL certified third-party testing and high-quality technical
service team.
2. Available and immediate delivery.
3. Producing capacity: 20,000sq meter/month.
4. Competitive price with no MOQ.
Files Requested For PCB Assembly Quotation
---In order to provide you with the most efficient and accurate
quote on manufacturing the requested unit, we ask that you provide
us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special
assembly instructions if required
Shinelink PCB Feature
| Number of Layer | 1 - 20 Layer |
| Maximum Processing Area | 680 × 1000MM |
| Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) |
| 4 Layer - 0.4MM ( 16 mil ) |
| 6 Layer - 0.8MM ( 32 mil ) |
| 8 Layer - 1.0MM ( 40 mil) |
| 10 Layer - 1.1MM ( 44 mil ) |
| 12 Layer - 1.3MM ( 52 mil ) |
| 14 Layer - 1.5MM ( 59 mil ) |
| 16 Layer - 1.6MM ( 63 mil ) |
| 18 Layer - 1.8MM ( 71 mil ) |
| Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
| 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
| Twisting and Bending | ≤ 0.75%, Min: 0.5% |
| Range of TG | 130 - 215 ℃ |
| Impedance Tolerance | ± 10%, Min: ± 5% |
| Hi-Pot Test | Max: 4000V/10MA/60S |
| Surface Treatment | HASL, With Lead, HASL Free Lead |
| Flash Gold, Immersion Gold |
| Immersion Silver, Immersion Tin |
| Gold Finger, OSP |
Shinelink kinds PCBA Product
PCB Assembly Capabilities
| Turnkey PCBA | PCB+components sourcing+assembly+package |
| Assembly details | SMT and Thru-hole, ISO lines |
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days |
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test |
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK |
| Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) |
| Components: Bill of Materials(BOM list) |
| Assembly: Pick-N-Place file |
| PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) |
| Max size: 20*20 inches(500*500mm) |
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
| Components details | Passive Down to 0201 size |
| BGA and VFBGA |
| Leadless Chip Carriers/CSP |
| Double-sided SMT Assembly |
| Fine Pitch to 0.8mils |
| BGA Repair and Reball |
| Part Removal and Replacement |
| Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly
process | Drilling-----Exposure-----Plating-----Etaching &
Stripping-----Punching-----Electrical Testing-----SMT-----Wave
Soldering-----Assembling-----ICT-----Function
Testing-----Temperature & Humidity Testing |
FAQ
1. What service can you provide?
We can provide PCB circuit board gerber file design,Copy and
Clone,OEM and ODM service.Not only produce PCB,PCB Assembly,but
also Mold making ,Plastic Injection,and Complete products
2. Are my design files secure when I send them to you?
Your files are held in complete safety and security while Shinelink
Technology Ltd is in possession of them. Your files are never
shared nor will any third parties have access to your design files.
Since they are your property, we respect the copyright of your
files. The customer controls the disposition of these files per
your requirements and written approval.
3. How do O-Leading ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008
standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,
X-ray Inspection, AOI (Automated Optical Inspector) and ICT
(in-circuit testing).
1.4.Dedicated quality assurance team with failure case analysis
process
1.5.Continuous staff training and education
