Specialized 4 layer Heavy copper pcb multilayer pcb manufacturer
4Layer PCB
Blue Soldermask
Immersion gold Surface
Size 168*125mm
Material, FR4, RoHS compliance
Quick Leadtime
Lead time for sample
2-3 days for single-sided board
4-5 days for double-sided board
6-7 days for multilayer board
24-48 hours for urgent
Lead time or opening Mould:
3-5 days for normal mould
5-7 days for hard mould
Lead time for mass production
5-7 days for single/double sided board
7-10 days for multilayer board
PCB capability and services
1. Single-sided, double side and multi-layer PCB. FPC. Flex-Rigid
PCB with competitive price, good quality and excellent service.
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material,
Polyimide, etc.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface
treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
5. Quantities range from Sample to mass order
6.100% E-Test
7. Qualified for CE and RoHS certificate
Feature
| Number of Layer | 1 - 20 Layer |
| Maximum Processing Area | 680 × 1000MM |
| Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) |
| 4 Layer - 0.4MM ( 16 mil ) |
| 6 Layer - 0.8MM ( 32 mil ) |
| 8 Layer - 1.0MM ( 40 mil) |
| 10 Layer - 1.1MM ( 44 mil ) |
| 12 Layer - 1.3MM ( 52 mil ) |
| 14 Layer - 1.5MM ( 59 mil ) |
| 16 Layer - 1.6MM ( 63 mil ) |
| 18 Layer - 1.8MM ( 71 mil ) |
| Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
| 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
| Twisting and Bending | ≤ 0.75%, Min: 0.5% |
| Range of TG | 130 - 215 ℃ |
| Impedance Tolerance | ± 10%, Min: ± 5% |
| Hi-Pot Test | Max: 4000V/10MA/60S |
| Surface Treatment | HASL, With Lead, HASL Free Lead |
| Flash Gold, Immersion Gold |
| Immersion Silver, Immersion Tin |
| Gold Finger, OSP |
PCBA capability and services SMT (Surface mounting technology), COB, DIP.
1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box,
Coil, cable inside etc)
6. OEM/ODM also welcomed
What we need
1. Gerber files of the bare PCB
2. Bill of materials to include: Manufacturer's part number, type
of part, type of packaging, component locations listed by reference
designators and quantity
3. Dimensional specifications for non-standard components
4. Assembly drawing, including any change notices
5. Final test procedures (if available)
Packing Terms
1. Inner packing. All the goods will be packed by vacuum
2. Outer packing. Standard carton
